PCS components—Power, Magnetics, and Protection (Source: Douyin): The Golden Rule: IGBT or SiC main switches (Source: VBsemi); Core: LCL filtering (Source: ElecFans); Note: Liquid cooling (Source: Douyin).
I.
Power Semiconductors
IGBT: Multi-chip parallel IGBT modules (Source: Douyin); SiC: High-frequency SiC MOSFETs (Source: SemiconductorX); Voltage Rating: 1200V/100A SiC (Source: VBsemi); Efficiency: 99.3% SiC efficiency (Source: slop); Losses: 70% switching losses (Source: Douyin)—Power: IGBT + SiC + Efficiency (Three core elements).
II.
Magnetic Components
Reactance: Filter reactors (Source: VBsemi); Transformers: Power transformers (Source: Big-Bit); LCL: 16kHz LCL filters (Source: ElecFans); Inductance: 50μH on the converter side (Source: ElecFans); Bridge Arm: Bridge arm reactors (Source: Patsnap)—Magnetics: Reactors + Transformers + LCL (Three components).
III. Capacitor Components
Support: DC support capacitor (Source: Douyin); Filtering: 60μF filter capacitor (Source: ElecFans); DC-Link: DC-Link ripple smoothing (Source: TDK); Aluminum Electrolytic: High-ripple aluminum electrolytic capacitor (Source: TDK); Damping: RC damping circuit (Source: Patsnap)—Capacitors: Support + Filtering + Damping (Three functions).
IV.
Protection Components
Circuit Breaking: 1000A main circuit breaker (Source: ABB); Contacting: 350A grid-connection contactor (Source: ABB); Fusing: Fuse protection (Source: Pawa); Relay: High-voltage DC relay (Source: TE); Pre-charging: Pre-charge circuit (Source: Douyin)—Protection: Circuit breaking + Contacting + Pre-charging (Three-fold protection).
V.
Thermal Management System
Air Cooling: Air cooling for low/medium power (Source: Douyin); Liquid Cooling: Liquid cooling for high power (Source: Douyin); Fins: Aluminum fin heat sink (Source: Douyin); Fan: EBM fan (Source: Pawa); Temperature Control: -12°C to 170°C temperature tolerance (Source: Douyin)—Thermal Management: Air cooling + Liquid cooling + Fins (Three methods).
VI.
Control Components
DSP: DSP/FPGA control board (Source: Douyin); Fiber Optic: Fiber optic interface (Source: Douyin); Sampling: Voltage and current sampling (Source: Douyin); Drive: Multi-channel drive power supply (Source: VBsemi); Communication: Modbus TCP module (Source: ABB)—Control: DSP + Sampling + Communication (Three layers).
7. Procurement Recommendations
First, select the power stage (IGBT/SiC); second, configure magnetics (LCL reactors); third, verify capacitors (DC-Link); fourth, check protection (circuit-breaking contactors);
and fifth, determine the cooling method (liquid cooling)—PCS components: Power + Magnetics + Protection (the three core elements).
